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This IC generates high-quality optical waveforms for use in 40 Gbps optical communications EML, and also facilitates size and power consumption reductions. Oki Semiconductor will continue to develop and deliver high-performance, high-quality optical communications driver IC to the optical communications IC market. The 40 Gbps EML driver will be exhibited and explained at the Oki Semiconductor booth (#2431) at the Optical Fiber Communications Conference & Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC2009) (www.ofcnfoec.org) joint venue to be held in San Diego, California, March 22 to 26 (Sun. to Thur.), 2009. Sales Plan
Main features
Glossary *1: EML (electro-absorption modulated laser) *2: XLMD-MSA *3: InP HEMT * Names of companies and products are trademarks or registered trademarks of the respective companies and organizations. Press Contact: For more information about Oki Semiconductor optical components Products, please contact: Yudhi Trisno |
The KGA8205 is provided in die form, allowing direct EML connection without the need to add external output bias circuit components. The chip size is small, 1.8mm x 1.2 mm, and the pad configuration complies with XLMD-MSA specifications, making this product ideal for EML modules based on XLMD-MSA with built-in drivers. This product uses InP HEMT (*3) device offering excellent high-speed characteristics, achieving high-speed operation and low power consumption of 1.1 W (2.3 Vpp output amplitude) for 43 Gbps operation.